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Product Details:
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| Name: | Copper Tungsten Alloy Parts | Model Number: | WCu 90/10 80/20 85/15 70/30 75/25 |
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| Shape: | Rod, Sheet, Rod, Plate, Ring, As Drawing | Application: | Industry Welding,electrics |
| Dimensions: | Dia 1-80mm | Length: | <=300mm |
| High Light: | Polished Copper Tungsten Alloy,Polished Copper Tungsten Plates,Polished Copper Tungsten Sheets |
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Polished Copper Tungsten Alloy W80Cu20 Plates/Sheets/Disk With High Quality
Tungsten Copper Alloy Introduction:
Tungsten copper alloy plate combines the advantages of metal tungsten and copper. Among them, tungsten has high melting point (tungsten melting point is 3410 ℃, copper melting point is 1080 ℃) and high density (tungsten density is 19.25g/cm, copper density is 8.92/cm3); Copper has excellent conductivity and thermal conductivity, and tungsten copper alloy (composition generally ranges from WCu10 to WCu50) has uniform microstructure, high temperature resistance, high strength, arc ablation resistance and high density; Moderate conductivity and thermal conductivity.
Tungsten Copper alloy Properties:
Tungsten copper alloy has features, such as, good heat and electrical conductive, high temperature resistance strength and ductility.
Tungsten Copper alloy applications:
1. Electrode material: WCu alloy is applied to discharge machining of high hardness materials and sheet electrodes. The surface finish of electrical machining products is high, the precision is high, the loss is low.
2. Tungsten copper heat sink is mainly used in electronic devices with high performance, high integration and high reliability. It matches with electronic materials such as Si, GaAs, Al2O3 and be to play the role of heat dissipation, support and protection. At present, tungsten copper heat sink and tungsten copper packaging materials have been widely used in high-power pulse microwave tubes, laser diodes, integrated circuit modules, power electronic devices, MCM, CPU and other components.
Tungsten Copper Alloy types,chemical compositions and main properties:
| Type | chemical composition of copper tungsten alloy(%) | resistivity(cm) | tensile strength(kg/mm2) | hardness | density(g/cm3) | |
| W | Cu | |||||
| F6002E | 60 | balance | <=3.26*10-6 | >=130 | >=160 | >=12.70 |
| 70 | <=3.80*10-6 | >=200 | >=13.80 | |||
| 80 | <=4.00*10-6 | >=220 | >=15.00 | |||
| Brand and NO. | Chemical components% | Physical properties | ||||||
|
Cu |
Total impurities ≤ |
W |
Density (g/cm³) ≥ |
Hardness HB ≥ |
Resistivity (µΩ·cm) ≤ |
Conductivity IACS%≥ |
Bending strength Mpa≥ |
|
| CuW(50) | 50±2.0 | 0.5 | Bal. | 11.85 | 115 | 3.2 | 54 | |
| CuW(55) | 45±2.0 | 0.5 | Bal. | 12.30 | 125 | 3.5 | 49 | |
| CuW(60) | 40±2.0 | 0.5 | Bal. | 12.75 | 140 | 3.7 | 47 | |
| CuW(65) | 35±2.0 | 0.5 | Bal. | 13.30 | 155 | 3.9 | 44 | |
| CuW(70) | 30±2.0 | 0.5 | Bal. | 13.80 | 175 | 4.1 | 42 | 790 |
| CuW(75) | 25±2.0 | 0.5 | Bal. | 14.50 | 195 | 4.5 | 38 | 885 |
| CuW(80) | 20±2.0 | 0.5 | Bal. | 15.15 | 220 | 5.0 | 34 | 980 |
| CuW(85) | 15±2.0 | 0.5 | Bal. | 15.90 | 240 | 5.7 | 30 | 1080 |
| CuW(90) | 10±2.0 | 0.5 | Bal. | 16.75 | 260 | 6.5 | 27 | 1160 |
We also offer tungsten copper alloy rings, plates, spare parts, etc..
Contact Person: Lisa Ma
Tel: 86-15036139126
Fax: 86-371-66364729
