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| Name: | Tungsten Ion Implant Spare Parts | Application: | Semiconductor, Ion Implantation |
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| Shape: | According To Drawings | Density: | 19.1g/cm3 |
| Standard: | ASTM B760-1 | Purity: | 99.95% |
| Material: | Tungsten | Surface: | Ground, Machined |
| High Light: | CNC Tungsten Machined Parts,Semiconductor Industries Tungsten Machined Parts,Ion Implantation Tungsten Machined Parts |
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CNC Tungsten Machining Parts For Electronic and Semiconductor Industries
Tungsten has high melting point, high temperature strength, creep resistance, good thermal conductivity, electric conductivity and electron emission properties, large specific gravity, low coefficient of expansion and low metal vapor pressure. It is generally prepared by powder metallurgy.
Chemical composition: Tungsten > 99.95%
Physical properties: density: 19.3g/cm3
Melting point (liquid): 3422 ° C
Conductivity: 30% IACS min
Specification and chemical compositions
| Material | Type | Chemical Composition (by wt.) |
| Pure Tungsten | W1 | >99.95%min. Mo |
| Tungsten Copper Alloy | WCu | 10%~50% Cu / 50%~90% W |
| Tungten Heavy Alloy | WNiFe | 1.5 % - 10 % Ni, Fe, Mo |
| Tungten Heavy Alloy | WNiCu | 5 % - 9.8 % Ni, Cu |
| Tungsten Rhenium | WRe | 5,0 % Re |
| Moly Tungsten | MoW50 | 0,0 % W |
Application: tungsten spare parts for semiconductor
1. Most tungsten parts in the semiconductor industry;
2. We produce tungstem parts with high density, purity and accuracy and homogenous internal structure;
3. Tungsten parts are made according to the customer drawings.
Package and delivery
Contact Person: Lisa Ma
Tel: 86-15036139126
Fax: 86-371-66364729
